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Connection pad layouts   

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Abstract: In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals. ...

Agent: Hewlett Packard Company - Fort Collins, CO, US
Inventors: Noah Lassar, Mohammad Akhavain, Michael Martin
USPTO Applicaton #: #20070169342 - Class: 029843000 (USPTO) -

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Related Patent Categories: Metal Working, Method Of Mechanical Manufacture, Electrical Device Making, Conductor Or Circuit Manufacturing, On Flat Or Curved Insulated Base, E.g., Printed Circuit, Etc., Assembling Terminal To Base, By Metal Fusion Bonding
The Patent Description & Claims data below is from USPTO Patent Application 20070169342, Connection pad layouts.

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